# US 2019/0244931 A1 · Land grid array package extension > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0244931 A1 - Document ID: US20190244931A1 - Status: Published application - Kind: A1 - Application number: 16/387,432 - Filed: 2019-04-17 - Published: 2019-08-08 - Earliest claimed: 2016-12-28 - Assignees: Intel Corporation - Applicants: Intel Corporation - Inventors: Tyler LEUTEN; Min-Tih LAI - Web page: https://patentgrep.com/patent/US20190244931A1 ## CPC - H10W 90/00: Package configurations - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/68: Shapes or dispositions thereof - H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 72/00: Interconnections or connectors in packages - H10W 72/07252: {changes in structures or sizes} - H10W 72/07254: {changes in dispositions} - H10W 72/227: {Multiple bumps having different sizes} - H10W 72/247: {Dispositions of multiple bumps} - H10W 72/354: {comprising polymers} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/732: {between stacked chips} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract BGA packages with a LGA package extension. First lands on a substrate are populated with solder balls, while only solder paste is dispensed on second lands that are surrounded by the first lands. Differences in solder stand-off may accommodate non-planarity in a package or the insertion of an LGA extension component, such as an IC or one or more discrete devices. Where an LGA extension component is attached to the second lands, solder paste may be further dispensed on third lands located on a package-side of the extension component. A BGA package is then attached to the first lands and third lands. The larger volume BGA solder connections maintaining mechanical reliability, particularly where the solder ball interconnects form a perimeter surrounding the low-volume solder interconnects. ## Claims ### Claim 1 A method of fabricating a microelectronic package assembly, the method comprising: applying solder paste to at least first lands of a substrate; dispensing solder balls on second lands of the substrate, the solder balls having a greater solder volume the solder paste; and attaching one or more components to the substrate by reflowing the solder paste to a first stand-off height and reflowing the solder balls to a second stand-off height. ### Claim 2 (depends on 1) The method of claim 1, wherein the first stand-off height is no more than 100 μm; and the second stand-off height is at least 200 μm. ### Claim 3 (depends on 2) The method of claim 2, wherein a difference between the first and second stand-off heights accommodates a recess in a package of the components, the recess located over only one of the first or second lands. ### Claim 4 (depends on 3) The method of claim 3, wherein attaching the one or more components further comprises attaching a recessed face of the package to the second lands by reflowing the solder balls, and attaching a non-recessed face of the package to the first lands by reflowing the solder paste. ### Claim 5 (depends on 1) The method of claim 1, wherein attaching the one or more components further comprises inserting of a first of the components between the substrate and a second of the components. ### Claim 6 (depends on 5) The method of claim 5, wherein the first of the components is inserted between a recessed face of the package, and attaching one or more of the components further comprises: attaching the first of the components to the substrate by reflowing the solder paste; and attaching a non-recessed face of the package to the first lands by reflowing the solder balls. ### Claim 7 (depends on 1) The method of claim 1, wherein attaching the one or more components further comprises: attaching a first of the components to the first lands by reflowing the solder paste; and attaching a second of the components to the second lands by reflowing the solder balls, the second of the components covering the first of the components with the second solder features having a stand-off height at least equal to a thickness of the first of the components summed with a stand-off height of the first solder features ### Claim 8 (depends on 7) The method of claim 7, further comprising: applying solder paste to third lands located on the first of the components; and attaching the second of the components to the third lands by reflowing the solder paste concurrently with the solder balls. ### Claim 9 (depends on 7) The method of claim 7, wherein: attaching the first of the components further comprises attaching a first electrode of a capacitor to the first lands; and attaching the second of the components to the third lands further comprises attaching a second electrode of the capacitor to the second of the components. ### Claim 10 (depends on 1) The method of claim 1, wherein the second lands form a perimeter surrounding the first lands. ### Claim 11 A method comprising: receiving a substrate; dispensing solder paste on lands of the substrate; populating a subset of the lands with solder balls; and attaching one or more package components to the substrate by reflowing the solder paste and solder balls into solder features of different stand-off height. ### Claim 12 (depends on 11) The method of claim 11, wherein attaching one or more package component further comprises: attaching a first component to first lands lacking the solder balls by reflowing the solder paste; and attaching a second component to second lands by reflowing the solder balls. ### Claim 13 (depends on 12) The method of claim 12, wherein: attaching the first component to the first lands further comprises attaching a first side of the first component to the first lands; the method further comprises dispensing solder paste on a second side of the first component, opposite the first side; and the method further comprises attaching the second component to the first component by reflowing the solder paste on the second side of the first component. ### Claim 14 (depends on 13) The method of claim 13, wherein the second lands form a perimeter surrounding the first lands. ### Claim 15 (depends on 12) The method of claim 12, wherein the first component comprises a coupling capacitor. ### Claim 16 (depends on 13) The method of claim 13, wherein the second component comprising a package comprising one or more integrated circuit chips. ### Claim 17 (depends on 14) The method of claim 14, wherein the package comprises a non-planar package substrate, the package substrate comprises a recess to at least partially accommodate a z-height of the first component. ### Claim 18 A method, comprising: receiving a printed circuit board including a plurality of metallized lands arrayed over a package assembly footprint; dispensing solder balls onto a first subset of the lands, the first subset located at a perimeter edge of the package assembly footprint; dispensing solder paste onto a second subset of the lands where no solder balls were dispensed; and attaching one or more components to the printed circuit board by reflowing the solder balls and solder paste. ### Claim 19 (depends on 18) The method of claim 18, wherein dispensing the solder balls further comprises dispensing solder paste onto the first subset of the lands and adhering the solder ball to the first subset of lands with the solder paste dispensed thereon. ### Claim 20 (depends on 18) The method of claim 18, wherein attaching the one or more components comprises attaching a non-planar package substrate, the package substrate comprising a recess that at least partially accommodate a z-height of a component located between the package substrate and the printed circuit board.