# US 2019/0244875 A1 · Heat conductive sheet and method of producing same, and heat dissipation device

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- Number: US 2019/0244875 A1
- Document ID: US20190244875A1
- Status: Published application
- Kind: A1
- Application number: 16/078,237
- Filed: 2017-02-17
- Published: 2019-08-08
- Earliest claimed: 2016-02-25
- Assignees: Zeon Corporation
- Applicants: Zeon Corporation
- Inventors: Toyokazu ITO; Hiromi KITAGAWA; Gen KOBAYASHI
- Web page: https://patentgrep.com/patent/US20190244875A1

## CPC

- B32B 27/306: {comprising vinyl acetate or vinyl alcohol (co)polymers}
- H10W 40/251: {Organics}
- B32B 7/12: using interposed adhesives or interposed materials with bonding properties
- B32B 25/042: {of natural rubber or synthetic rubber}
- B32B 25/08: of synthetic resin
- B32B 25/12: comprising natural rubber
- B32B 25/14: comprising {synthetic rubber copolymers (B32B25/18 and B32B25/20 take precedence)}
- B32B 25/16: comprising polydienes {homopolymers} or poly-halodienes {homopolymers (B32B25/12 takes precedence)}
- B32B 25/18: comprising butyl or halobutyl rubber
- B32B 27/08: of synthetic resin
- B32B 27/18: characterised by the use of special additives
- B32B 27/22: using plasticisers
- B32B 27/281: {comprising polyimides}
- B32B 27/283: {comprising polysiloxanes}
- B32B 27/285: {comprising polyethers}
- B32B 27/286: {comprising polysulphones; polysulfides}
- B32B 27/288: {comprising polyketones}
- B32B 27/302: {comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers}
- B32B 27/304: {comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF}
- B32B 27/308: {comprising acrylic (co)polymers}
- B32B 27/32: comprising polyolefins {(comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30)}
- B32B 27/322: {comprising halogenated polyolefins, e.g. PTFE}
- B32B 27/34: comprising polyamides
- B32B 27/36: comprising polyesters
- B32B 27/365: {comprising polycarbonates}
- B32B 27/38: comprising epoxy resins
- B32B 27/40: comprising polyurethanes
- B32B 27/42: comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
- C08K 3/04: Carbon
- C08K 3/041: {Carbon nanotubes}
- C08L 101/00: Compositions of unspecified macromolecular compounds
- H05K 7/20: Modifications to facilitate cooling, ventilating, or heating
- H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties}
- H10W 40/10: Arrangements for heating
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/25: characterised by their materials
- B32B 2250/24: All layers being polymeric
- B32B 2262/106: Carbon fibres, e.g. graphite fibres
- B32B 2264/108: Carbon, e.g. graphite particles
- B32B 2270/00: Resin or rubber layer containing a blend of at least two different polymers
- B32B 2307/202: Conductive
- B32B 2307/302: Conductive
- B32B 2307/306: Resistant to heat
- B32B 2307/536: Hardness
- B32B 2307/546: Flexural strength; Flexion stiffness
- B32B 2307/714: Inert, i.e. inert to chemical degradation, corrosion
- B32B 2307/72: Density
- B32B 2307/732: Dimensional properties
- B32B 2307/748: Releasability
- B32B 2429/00: Carriers for sound or information
- B32B 2429/02: Records or discs
- B32B 2457/00: Electrical equipment
- B32B 2457/08: PCBs, i.e. printed circuit boards
- B32B 2457/10: Batteries
- B32B 2457/14: Semiconductor wafers
- B32B 2457/18: Fuel cells
- B32B 2457/202: LCD, i.e. liquid crystal displays
- B32B 2457/204: Plasma displays
- B32B 2457/206: Organic displays, e.g. OLED
- C08K 3/046: {Carbon nanorods, nanowires, nanoplatelets or nanofibres}
- C08L 27/12: containing fluorine atoms
- C08L 27/14: Homopolymers or copolymers of vinyl fluoride
- C08L 27/16: Homopolymers or copolymers or vinylidene fluoride
- C08L 27/18: Homopolymers or copolymers or tetrafluoroethene
- C08L 27/20: Homopolymers or copolymers of hexafluoropropene
- C08L 2205/02: containing two or more polymers of the same C08L -group
- C08L 2205/025: containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
- C08L 2666/55: Carbon
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.

## Claims

### Claim 1

A heat conductive sheet comprising a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20° C./W or less.

### Claim 2 (depends on 1)

The heat conductive sheet according to claim 1, having a thermal resistance value change rate when applied pressure is changed from 0.50 MPa to 0.05 MPa of +150.0% or less.

### Claim 3 (depends on 1)

The heat conductive sheet according to claim 1, having a tack measured by a probe tack test of 1.40 N or less.

### Claim 4 (depends on 1)

The heat conductive sheet according to any one of claim 1, wherein the particulate carbon material is contained in an amount of 20 parts by mass or more per 100 parts by mass of the resin.

### Claim 5 (depends on 1)

The heat conductive sheet according to any one of claim 1, wherein the resin is a thermoplastic resin.

### Claim 6 (depends on 5)

The heat conductive sheet according to claim 5, wherein the thermoplastic resin is a thermoplastic resin that is liquid at ordinary temperature.

### Claim 7 (depends on 1)

A heat dissipation device comprising the heat conductive sheet as recited in claim 1 interposed between a heat source and a heat radiator.

### Claim 8

A method of producing a heat conductive sheet comprising:
shaping a composition containing a resin and a particulate carbon material into a sheet by pressure application to provide a pre-heat conductive sheet;
obtaining a laminate either by stacking a plurality of the pre-heat conductive sheets in a thickness direction or by folding or rolling the pre-heat conductive sheet; and
slicing the laminate at an angle of 45° or less relative to the stacking direction to obtain a heat conductive sheet.