# US 2019/0244833 A1 · Heat releasing semiconductor chip package and method for manufacturing the same

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- Number: US 2019/0244833 A1
- Document ID: US20190244833A1
- Status: Published application
- Kind: A1
- Application number: 16/387,162
- Filed: 2019-04-17
- Published: 2019-08-08
- Earliest claimed: 2014-06-24
- Assignees: MagnaChip Semiconductor, Ltd.
- Applicants: Magnachip Semiconductor, Ltd.
- Inventors: Jo Han KIM; Hee Jin PARK; Kyeong Su KIM; Jae Jin LEE
- Web page: https://patentgrep.com/patent/US20190244833A1

## CPC

- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 40/037: {Assembling together parts thereof}
- H10W 40/251: {Organics}
- H10W 40/778: {in encapsulations}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 72/072: {of bump connectors}
- H10W 72/073: {of die-attach connectors}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.

## Claims

### Claim 1

A heat releasing semiconductor chip package, comprising:
a first surface of a semiconductor chip attached onto an insulating film;
a coating liquid injected onto a second surface of the semiconductor chip to form a liquefied coating layer; and
a heat releasing layer, formed by curing the liquefied coating layer
wherein the coating liquid comprises a liquefied molding compound for heat releasing and fine alumina particles.

### Claim 2 (depends on 1)

The heat releasing semiconductor chip package of claim 1, wherein curing the coating layer comprises performing a pre-curing and performing a post-curing.

### Claim 3 (depends on 1)

The heat releasing semiconductor chip package of claim 1, wherein attaching the first surface of the semiconductor chip onto the insulating film further comprises filling an epoxy molding compound into a space between the insulating film and the semiconductor chip.

### Claim 4 (depends on 3)

The heat releasing semiconductor chip package of claim 3, wherein filling the epoxy molding compound further comprises performing a pre-curing for curing the epoxy molding compound and performing a post-curing for curing the epoxy molding compound.

### Claim 5 (depends on 4)

The heat releasing semiconductor chip package of claim 4, wherein performing the post-curing comprises curing the liquefied coating layer or the epoxy molding compound at a temperature of 100° C.-200° C.

### Claim 6 (depends on 1)

The heat releasing semiconductor chip package of claim 1, wherein performing the post-curing comprises curing the liquefied coating layer at a temperature of 100° C.-200° C.

### Claim 7 (depends on 1)

The heat releasing semiconductor chip package of claim 1, wherein the molding compound for heat releasing is a silicon-based molding compound or an epoxy-based molding compound.

### Claim 8 (depends on 1)

The heat releasing semiconductor chip package of claim 1, wherein an area of the heat releasing layer is 5 mm-10 mm by 10 mm-40 mm and a thickness of the heat releasing layer is 0.5-3.0 mm.

### Claim 9

A heat releasing semiconductor chip package, comprising:
an insulating film attached onto a first surface of a semiconductor chip; and
a liquefied coating layer injected on a second surface of the semiconductor chip to form a heat releasing layer by curing the liquefied coating layer,
wherein the liquefied coating layer comprises a liquefied heat releasing molding compound and fine alumina particles.

### Claim 10 (depends on 9)

The heat releasing semiconductor chip package of claim 9, wherein the liquefied heat releasing molding compound is a silicon-based molding compound or an epoxy-based molding compound.

### Claim 11 (depends on 9)

The heat releasing semiconductor chip package of claim 9, wherein the liquefied heat releasing molding compound is a mixture formed by mixing a liquefied silica colloid with a silicone rubber or a silicone resin.