# US 2019/0244831 A1 · Multilayer batch microfabricated magnetic shielding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0244831 A1 - Document ID: US20190244831A1 - Status: Published application - Kind: A1 - Application number: 16/264,979 - Filed: 2019-02-01 - Published: 2019-08-08 - Earliest claimed: 2018-02-02 - Assignees: The Regents of the University of California - Applicants: The Regents of the University of California - Inventors: Robert N. CANDLER; Jimmy Chen-Yen WU; Ling LI; Jere C. HARRISON - Web page: https://patentgrep.com/patent/US20190244831A1 ## CPC - H10P 50/00: Etching of wafers, substrates or parts of devices - H10N 50/01: Manufacture or treatment - H10W 20/023: {the interconnections being through-semiconductor vias} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10N 50/80: Constructional details - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A microfabrication process includes: (1) etching a shield pattern into a substrate; (2) forming a set of shielding layers on the substrate and in the shield pattern, wherein the shielding layers include n+1 magnetic layers and n spacing layers, n is 0 or an integer that is 1 or greater than 1, and each spacing layer is disposed between a pair of magnetic layers; and (3) planarizing the substrate to expose edges of the shielding layers. ## Claims ### Claim 1 A microfabrication process comprising: etching a shield pattern into a substrate; forming a set of shielding layers on the substrate and in the shield pattern, wherein the shielding layers include n+1 magnetic layers and n spacing layers, n is 0 or an integer that is 1 or greater than 1, and each spacing layer is disposed between a pair of magnetic layers; and planarizing the substrate to expose edges of the shielding layers. ### Claim 2 (depends on 1) The microfabrication process of claim 1, wherein etching the shield pattern includes forming a trench in the substrate. ### Claim 3 (depends on 2) The microfabrication process of claim 2, wherein the trench includes a portion having a nonlinear shape. ### Claim 4 (depends on 1) The microfabrication process of claim 1, wherein forming the shielding layers is performed by electrodeposition. ### Claim 5 (depends on 4) The microfabrication process of claim 4, wherein forming the shielding layers includes forming a seed layer on the substrate and in the shield pattern, prior to electrodepositing the shielding layers. ### Claim 6 (depends on 1) The microfabrication process of claim 1, wherein the magnetic layers include a magnetic material. ### Claim 7 (depends on 1) The microfabrication process of claim 1, wherein the magnetic layers include a nickel-iron alloy or a mu-metal. ### Claim 8 (depends on 1) The microfabrication process of claim 1, wherein n is 1 or greater. ### Claim 9 (depends on 8) The microfabrication process of claim 8, wherein the spacing layers have a lower permeability relative to the magnetic layers. ### Claim 10 (depends on 8) The microfabrication process of claim 8, wherein the spacing layers include a conductive material. ### Claim 11 (depends on 8) The microfabrication process of claim 8, wherein the spacing layers include a metal or a metal alloy. ### Claim 12 (depends on 1) The microfabrication process of claim 1, further comprising forming an insulating layer at least partially covering the shielding layers. ### Claim 13 (depends on 1) The microfabrication process of claim 1, wherein forming the shielding layers is performed using a robotic plater. ### Claim 14 (depends on 1) The microfabrication process of claim 1, wherein the substrate is a first substrate, the set of shielding layers is a first set of shielding layers, planarizing the first substrate yields a first portion of a shielded enclosure, and further comprising: etching the shield pattern into a second substrate; forming a second set of shielding layers on the second substrate and in the shield pattern of the second substrate, wherein the second set of shielding layers include n+1 magnetic layers and n spacing layers, n is 0 or an integer that is 1 or greater than 1, and each spacing layer is disposed between a pair of magnetic layers; and planarizing the second substrate to expose edges of the second set of shielding layers, yielding a second portion of the shielded enclosure. ### Claim 15 (depends on 14) The microfabrication process of claim 14, further comprising: positioning a device between the first portion and the second portion of the shielded enclosure; and bonding the first portion and the second portion of the shielded enclosure together. ### Claim 16 A shielded device comprising: a shielded enclosure including a first portion and a second portion, wherein the first portion of the shielded enclosure includes a first substrate defining a first trench, and a first plurality of shielding layers in the first trench, and wherein the second portion of the shielded enclosure is bonded to the first portion of the shielded enclosure, and the second portion of the shielded enclosure includes a second substrate defining a second trench, and a second plurality of shielding layers in the second trench; and a device disposed between the first portion and the second portion of the shielded enclosure, and enclosed by the first plurality of shielding layers and the second plurality of shielding layers. ### Claim 17 A fabrication process comprising: providing a structure including a device and having a non-planar surface; and forming a plurality of shielding layers on the non-planar surface, wherein the shielding layers include n+1 magnetic layers and n spacing layers, n is an integer that is 1 or greater than 1, and each spacing layer is disposed between a pair of magnetic layers. ### Claim 18 (depends on 17) The fabrication process of claim 17, wherein providing the structure includes forming a mold covering the device, and the non-planar surface is a surface of the mold. ### Claim 19 (depends on 17) The fabrication process of claim 17, wherein forming the shielding layers is performed by electrodeposition. ### Claim 20 (depends on 19) The fabrication process of claim 19, wherein forming the shielding layers includes forming a seed layer on the non-planar surface, prior to electrodepositing the shielding layers.