# US 2019/0244818 A1 · Laser bonding apparatus for three-dimensional molded sculptures

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- Number: US 2019/0244818 A1
- Document ID: US20190244818A1
- Status: Published application
- Kind: A1
- Application number: 15/577,859
- Filed: 2017-06-22
- Published: 2019-08-08
- Earliest claimed: 2016-10-20
- Assignees: Crucial Machines Co., Ltd.
- Applicants: Crucial Machines Co., Ltd.
- Inventors: Jae Joon CHOI; Byung Rock KIM
- Web page: https://patentgrep.com/patent/US20190244818A1

## CPC

- B23K 1/0056: {soldering by means of beams, e.g. lasers, electron beams [EB]}
- F21S 41/151: arranged in one or more lines
- B23K 1/0016: {Soldering of electronic components}
- B23K 1/20: Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K 3/08: Auxiliary devices therefor
- B23K 3/087: {Soldering or brazing jigs, fixtures or clamping means}
- B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K 26/0823: {Devices involving rotation of the workpiece}
- B23K 35/025: {Pastes, creams or slurries}
- B23K 37/047: moving work to adjust its position between soldering, welding or cutting steps (B23K37/053 takes precedence)
- F21S 41/192: {Details of lamp holders, terminals or connectors}
- F21S 43/14: Light emitting diodes [LED]
- F21S 43/15: Strips of light sources
- F21S 43/195: {Details of lamp holders, terminals or connectors}
- H05K 13/046: {Surface mounting (surface mounted components H05K3/341)}
- H05K 13/0465: {by soldering (H05K13/0469 takes precedence)}
- H05K 13/0469: {by applying a glue or viscous material}
- H10P 34/42: with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20)
- H10P 72/0436: {mainly by radiation}
- H10P 72/16: {Trays for chips}
- H10P 72/30: for conveying, e.g. between different workstations
- H10P 72/3212: {the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames}
- H10P 72/3218: {Conveying cassettes, containers or carriers}
- H10P 72/53: {using optical controlling means}
- H10W 72/011: {Apparatus therefor}
- H10W 72/071: {Connecting or disconnecting}
- H10W 72/072: {of bump connectors}
- H10W 72/90: Bond pads, in general
- H10H 20/036: {of packages}
- H10W 70/682: {comprising holes having chips therein}
- H10W 72/0198: {batch processes}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07168: {Means for storing or moving the material for the connector}
- H10W 72/07173: {Means for moving chips, wafers or other parts, e.g. conveyor belts}
- H10W 72/07178: {Means for aligning}
- H10W 72/07188: {Apparatus chuck}
- H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/07335: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

## Claims

### Claim 1

A laser bonding apparatus for three-dimensional structures comprising:
a three-dimensional structure providing unit for providing a plurality of three-dimensional structures to which adhesives are applied and electronic components are attached; and
a laser boding unit for bonding the electronic components to the three-dimensional structures by irradiating a laser beam to the electronic components attached to the three-dimensional structures.

### Claim 2

A laser bonding apparatus for three-dimensional structures comprising:
an electronic component providing unit for mounting and transporting a plurality of electronic components;
a three-dimensional structure providing unit for supporting and conveying a plurality of three-dimensional structures;
an adhesive material applying unit for applying adhesive material to one of the three-dimensional structures;
an electronic component attaching unit for attaching an electronic component to the three-dimensional structure on which the adhesive material is applied; and
a laser bonding unit for bonding the electronic component to the three-dimensional structure by irradiating a laser beam to the electronic component attached to the three-dimensional structure.

### Claim 3 (depends on 2)

The laser bonding apparatus according to claim 2, wherein
the electronic component providing unit comprises:
a tray on which the plurality of electronic components are mounted; and
a tray transporting unit for transporting the tray in a predetermined direction.

### Claim 4 (depends on 3)

The laser bonding apparatus according to claim 3, wherein
the three-dimensional structure providing unit includes:
a working table for supporting a plurality of three-dimensional structures;
a working table conveying unit for conveying the working table on which the plurality of three-dimensional structures are mounted.

### Claim 5 (depends on 4)

The laser bonding apparatus according to claim 4, wherein
the three-dimensional structures are workpieces having curved portions of regular type.

### Claim 6 (depends on 3)

The laser bonding apparatus according to claim 3, wherein
the three-dimensional structure providing unit includes:
a seat on which the plurality of three-dimensional structures are seated;
a driving shaft connected to the seat;
a driving belt connected to the driving shaft;
a first motor for rotating the driving belt;
a coupler coupled to the driving shaft;
a support to which the coupler is rotatably coupled; and
a second motor connected to the coupler for rotating the coupler.

### Claim 7 (depends on 6)

The laser bonding apparatus according to claim 6, wherein
the three-dimensional structures are workpieces having curved portions of irregular type.

### Claim 8 (depends on 4)

The laser bonding apparatus according to claim 4, wherein
the adhesive material applying unit includes:
a dispenser for applying solder paste or NCP to the three-dimensional structures mounted on the working table;
a first transfer unit for transferring the dispenser vertically and horizontally within a plane perpendicular to a tray transporting direction; and
a first gantry for supporting the first transfer unit.

### Claim 9 (depends on 8)

The laser bonding apparatus according to claim 8, wherein
the adhesive material applying unit further includes a first monitoring unit for detecting the alignment state of the dispenser with respect to the three-dimensional structures and application state of the solder paste or NCP to the three-dimension structures.

### Claim 10 (depends on 4)

The laser bonding apparatus according to claim 4, wherein
the electronic component attaching unit includes:
an electronic component attach for picking up the electronic component from the tray and attaching the electronic component to the three-dimensional structure on which the solder paste or NCP is applied;
a second transfer unit for transferring the electronic component attach vertically and horizontally within a plane perpendicular to a tray transporting direction; and
a second gantry for supporting the second transfer unit.

### Claim 11 (depends on 10)

The laser bonding apparatus according to claim 10, wherein
the electronic component attach further includes a second monitoring unit for detecting an alignment state of the electronic component attach with respect to the three-dimensional structures and an attachment state of the electronic component to the three-dimensional structures.

### Claim 12 (depends on 2)

The laser bonding apparatus according to claim 2, wherein
the laser bonding unit includes:
a laser oscillator for emitting the laser beam to the electronic component attached to the three-dimensional structure;
a laser beam irradiating unit including a beam shaper and an optical system for converting the laser beam having Gaussian distribution outputted from the laser oscillator into square or rectangular surface beam having a uniform energy distribution;
a third transfer unit for moving the laser beam irradiating unit vertically and horizontally within a plane perpendicular to the direction of tray transport; and
a third gantry for supporting the third transfer unit.

### Claim 13 (depends on 12)

The laser bonding apparatus according to claim 12, wherein
the laser bonding unit further includes a third monitoring unit for detecting an alignment state of the laser beam irradiating unit with respect to the three-dimensional structures and a bonding state of the electronic component to the three-dimensional structures.

### Claim 14 (depends on 2)

The laser bonding apparatus according to claim 2, wherein
the three-dimensional structure is a structure for an automobile tail lamp or an automobile headlamp.

### Claim 15

A laser bonding method for a three-dimensional structure comprising:
providing a plurality of three-dimensional structures to which adhesives are applied and electronic components are attached; and
laser bonding the electronic components to the three-dimensional structures by irradiating a laser beam to the electronic components attached to the three-dimensional structures.

### Claim 16

A laser bonding method for a three-dimensional structure comprising:
mounting a plurality of three-dimensional structures to a working table;
conveying the working table on which the three-dimensional structures are mounted by a working table conveying unit;
applying adhesive material to one of the three-dimensional structures;
picking up and attaching an electronic component to the three-dimensional structure on which the adhesive material is applied; and
bonding the electronic component to the three-dimensional structure by irradiating a laser beam to the electronic component attached to the three-dimensional structure.

### Claim 17 (depends on 16)

The laser bonding method according to claim 16, wherein
the adhesive material is solder paste or NCP.

### Claim 18 (depends on 16)

The laser bonding method according to claim 16, wherein
the three-dimensional structure is a structure for an automobile tail lamp or an automobile headlamp.