# US 2019/0244755 A1 · Low Noise Capacitors

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2019/0244755 A1
- Document ID: US20190244755A1
- Status: Published application
- Kind: A1
- Application number: 16/240,860
- Filed: 2019-01-07
- Published: 2019-08-08
- Earliest claimed: 2014-06-11
- Assignees: AVX Corporation
- Applicants: AVX Corporation
- Inventors: Andrew P. Ritter; Carl L. Eggerding
- Web page: https://patentgrep.com/patent/US20190244755A1

## CPC

- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/224: Housing; Encapsulation
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/2325: {characterised by the material of the terminals}
- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- H05K 1/181: associated with surface mounted components
- H05K 2201/10015: Non-printed capacitor
- H05K 2201/2045: Protection against vibrations
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/51: Plural diverse manufacturing apparatus including means for metal shaping or assembling
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Relatively low noise capacitors are provided for surface mounted applications. Electro-mechanical vibrations generate audible noise, which are otherwise relatively reduced through modifications to MLCC device structures, and/or their mounting interfaces on substrates such as printed circuit boards (PCBs). Different embodiments variously make use of flexible termination compliance so that surface mounting has reduced amplitude vibrations transmitted to the PCB. In other instances, side terminal and transposer embodiments effectively reduce the size of the mounting pads relative to the case of the capacitor, or a molded enclosure provides standoff, termination compliance and clamping of vibrations.

## Claims

### Claim 1

A surface mountable relatively low noise multilayer ceramic capacitor (MLCC) capacitor assembly, comprising:
a main body having a plurality of conductive layers of respective first and second polarities interleaved with a plurality of ceramic layers to form respective pairs of opposing capacitor plates in a stacked arrangement; and
respective first and second polarity terminations on opposite ends of said main body and electrically connected, respectively, to said first and second polarity conductive layers, wherein said terminations include a compliant layer for relatively dampening vibrations between said capacitor assembly and a surface on which it is mounted for relatively reducing electro-mechanical noise.

### Claim 2

Methodology for relatively reducing electro-mechanical noise associated with a surface mountable multilayer ceramic capacitor (MLCC) capacitor assembly, comprising:
providing a main body having a plurality of conductive layers of respective first and second polarities interleaved with a plurality of ceramic layers to form respective pairs of opposing capacitor plates in a stacked arrangement; and
forming respective first and second polarity terminations on opposite ends of said main body and electrically connected, respectively, to said first and second polarity conductive layers,
wherein said terminations include a compliant layer for relatively dampening vibrations between such capacitor assembly and a surface on which it is mounted for relatively reducing electro-mechanical noise.

### Claim 3

A surface mountable relatively low noise multilayer ceramic capacitor (MLCC) capacitor assembly, comprising:
a main body having a plurality of conductive layers of respective first and second polarities interleaved with a plurality of ceramic layers to form respective pairs of opposing capacitor plates in a stacked arrangement;
respective first and second polarity terminations on opposite ends of said main body and electrically connected, respectively, to said first and second polarity conductive layers; and
a molded case in which said main body is received with said terminations supported on a surface, for relatively dampening vibrations between said capacitor assembly and a surface on which it is mounted for relatively reducing electro-mechanical noise.

### Claim at position 4

4-8. (canceled)