# US 2019/0244753 A1 · Method for manufacturing electronic component with coil > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2019/0244753 A1 - Document ID: US20190244753A1 - Status: Published application - Kind: A1 - Application number: 16/385,603 - Filed: 2019-04-16 - Published: 2019-08-08 - Earliest claimed: 2013-03-14 - Assignees: Sumida Corporation - Applicants: Sumida Corporation - Inventors: Shinichi SAKAMOTO; Douglas James MALCOLM - Web page: https://patentgrep.com/patent/US20190244753A1 ## CPC - H01F 41/064: Winding non-flat conductive wires, e.g. rods, cables or cords - H01F 17/04: with magnetic core - H01F 27/022: {Encapsulation} - H01F 27/24: Magnetic cores - H01F 27/255: made from particles (H01F27/26 takes precedence) - H01F 27/2828: {Construction of conductive connections, of leads} - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01F 41/02: for manufacturing cores, coils, or magnets (H01F41/14 takes precedence; for dynamo-electric machines H02K15/00) - H01F 41/0246: {Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36)} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - Y10T 29/4902: Electromagnet, transformer or inductor - Y10T 29/49071: by winding or coiling - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened. ## Claims ### Claim 1 A method for manufacturing an electronic component comprising: placing a T-shaped core and an air-core coil in a mold; placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture; after placing the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened. ### Claim 2 (depends on 1) The method for manufacturing an electronic component according to claim 1, wherein the predetermined temperature is in a range of 120 to 200° C. and the predetermined time is in a range of 10 to 90 minutes. ### Claim 3 (depends on 1) The method for manufacturing an electronic component according to claim 1, further comprising: winding a wire to form the air-core coil; and preparing the T-shaped core separately from the forming the air-core coil, wherein an inside diameter of the air-core coil is larger than an outside diameter of a core part of the T-shaped core. ### Claim 4 (depends on 3) The method for manufacturing an electronic component according to claim 3, wherein a difference of the inside diameter of the air-core coil and the outside diameter of the core part of the T-shaped core is larger than a distance of at least two times a maximum particle in the mixture so that the mixture fills in a gap between the core part and the air-core coil. ### Claim 5 (depends on 1) The method for manufacturing an electronic component according to claim 1, further comprising: simultaneously preparing the mixture, the T-shaped core, and the air-core coil, wherein the metal magnetic material includes a Fe—Si—Cr alloy, and a viscosity of the mixture is in a range of 1,000 to 1,000,000 mPa·s at room temperature. ### Claim 6 (depends on 5) The method for manufacturing an electronic component according to claim 5, wherein a solvent is used for the preparing of the mixture. ### Claim 7 (depends on 1) The method for manufacturing an electronic component according to claim 1, further comprising: dipping wire ends of the air-core coil in solder so that insulating layers on the wire ends of the air-core coil are removed and the solder adheres to the wire ends of the air-core coil; and after the dipping, assembling the air-cored coil to the T-shaped core. ### Claim 8 (depends on 7) The method for manufacturing an electronic component according to claim 7, further comprising: placing the air-core coil on a first surface of the T-shaped core during the assembling; bending the end wires of the air-core coil at a side of the T-shaped core during the assembling; and fixing ends of the end wires of the air-core coil to a second surface of the T-shaped core opposite the first surface during the assembling. ### Claim 9 (depends on 1) The method for manufacturing an electronic component according to claim 1, wherein the mixture is supplied into the mold by a dispenser, and the dispenser includes: a material tank in which the mixture is stored; a cylinder; a flow passage fluidly connected between the material tank and the cylinder; a mixer disposed in the cylinder and configured to mix the mixture; a valve disposed in the flow passage, the valve being configured to selectively supply the mixture from the material tank to the cylinder via the flow passage; a valve driving member configured to drive the valve; a piston movably disposed in the cylinder and configured to move the mixture in the cylinder; and a discharge opening from which the mixture is supplied into the mold. ### Claim 10 (depends on 1) The method for manufacturing an electronic component according to claim 1, wherein the pressure is applied in the range of 0.1 to 20.0 kg/cm2 to the placed mixture in the mold by a movable punch of a press machine.