Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same
AssigneeLG Chem, Ltd.
InventorsYoon Gyung Cho, Kyung Yul Bae, Min Soo Park, Jung Sup Shim, Hyun Jee Yoo
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Abstract
Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.
Claims17
A pressure-sensitive adhesive composition, which has a gel content represented by Equation 1 of 50% or more, a micro gel content represented by Equation 2 of 3% or less, and a water vapor transmission rate in a thickness direction while being formed in a film having a thickness of 100 μm of 50 g/m2·day or less:
- Gel content (wt %)=B/A×100 [Equation 1]
- Micro gel content (wt %)=C/A×100 [Equation 2]
- wherein in Equations 1 and 2, A is a mass of the pressure-sensitive adhesive composition,
- in Equation 1, B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh sieve (pore size of 200 μm), and
- in Equation 2, C is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours, primarily filtered through a 200-mesh sieve (pore size:
- 200 μm), and secondarily filtered through a 1000-mesh sieve (pore size:
- 5 μm).
Dependencies are inferred from the claim text.