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US 2019/0241733 A1Published application
Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
AssigneeTaiwan Union Technology Corporation
InventorsChih-Wei LIAO, Ju-Ming HUANG, Guan-Syun TSENG
Life of this patent
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Abstract
A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), wherein, R11 to R16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).
Claims20
A resin composition, comprising:
- (A) an epoxy resin;
- (B) an amino group-containing hardener;
- and
- (C) a compound of the following formula (I):
- in formula (I),
- R11 is H or a C1 to C25 alkyl, R12 and R13 are independently a C2 to C27 alkyl, and the total carbon number of —CR11R12R13 is 10 to 30;
- R14, R15 and R16 are independently H or a C1 to C10 alkyl;
- A1 is *—C(═O)O—, *—CH2O—, or *—CH2OC(═O)—, wherein * indicates the end bonded to —CR11R12R13;
- and
- A2 is a covalent bond or a C1 to C8 alkylene with or without an ether bond,
- wherein based on 100 parts by weight of the epoxy resin (A), the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight.
8 more elements
Dependencies are inferred from the claim text.