US 2019/0241729 A1Published application

Resin composition, laminate sheet, and multilayer printed wiring board

AssigneeHitachi Chemical Company, Ltd.

InventorsTakao TANIGAWA, Tetsuroh IRINO, Minoru KAKITANI, Kouji MORITA

Life of this patent

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Abstract

The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Claims10

Dependent claims

A resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

Dependencies are inferred from the claim text.

Facts

Application: 16/318,726Filed 18 Jul 2017
Priority: JP 2016-14138719 Jul 2016
Published: 8 Aug 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification35 codes

C08G 73/12
Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors: unsaturated polyimide precursors
C08L 39/04
Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon…:…
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
B32B 27/34
Layered products comprising a layer of synthetic resin: comprising polyamides

Family

US 11,377,546 B2Related patent
US 2019/0241729 A1This patent

From the US filing history. Foreign family members aren’t listed.

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