Methods for producing thin-film layers and microsystems having thin-film layers

A method for producing a thin-film layer, wherein the method comprises:

• providing a carrier substrate;
• providing a sacrificial layer on the carrier substrate;
• providing the thin-film layer on the sacrificial layer;
• structuring the thin-film layer in order to obtain in a lateral plane of the thin-film layer an inner area of the thin-film layer which is at least partly surrounded by an outer area of the thin-film layer, wherein during the process of structuring the thin-film layer, at least one opening arises in the thin-film layer which at least partially frees the inner area of the thin-film layer in the lateral plane, wherein during the process of structuring the thin-film layer, at least two webs remain which extend in a lateral plane of the thin-film layer from the outer area of the thin-film layer into the opening in the direction of the inner area of the thin-film layer;
• at least partly removing the sacrificial layer proceeding from the thin-film layer in order to eliminate a contact between the inner area of the thin-film layer and the sacrificial layer;
• and
• detaching the inner area of the thin-film layer from the outer area of the thin-film layer.

A method for producing a thin-film layer, wherein the method comprises:

• providing a carrier substrate;
• providing an anti-sticking structure on the carrier substrate;
• providing a sacrificial layer on the anti-sticking structure and the carrier substrate;
• providing the thin-film layer on the sacrificial layer;
• structuring the thin-film layer in order to obtain in a lateral plane of the thin-film layer an inner area of the thin-film layer which is at least partly surrounded by an outer area of the thin-film layer and is arranged in a vertical direction above the anti-sticking structure, wherein during the process of structuring the thin-film layer, at least one opening arises in the thin-film layer which at least partially frees the inner of the thin-film layer in the lateral plane, wherein during the process of structuring the thin-film layer, at least two webs remain which extend in a lateral plane of the thin-film layer from the outer area of the thin-film layer into the opening in the direction of the inner area of the thin-film layer;
• at least partly removing the sacrificial layer proceeding from the thin-film layer in order to eliminate a contact between the inner area of the thin-film layer and the sacrificial layer, wherein during the process of at least partly removing the sacrificial layer, the anti-sticking structure is at least partly exposed.