US 2019/0240918 A1 · Method For Reversible Bonding

Abstract

A method of reversible bonding based on deposition of a coating capable of an indefinite number of reversible bonding cycles as enable by bond exchange reactions is provided. This is accomplished by deposition of crosslinkable aromatic polyester oligomers on a substrate. The coated article is heated to produce a fully thermoset network by condensation reactions. The fully thermoset network has access to a type of bond exchange reaction within the resin that permits the dynamic exchange of ester bonds within the resin. To execute the bonding step a source of heat is applied at a pressure. To debond, there is applied force in tension and/or shear that causes the coating to fail. The reversibility of the process is contingent on the cohesive (rather than adhesive) failure of the coating—that is, the coating must not delaminate from the substrate. Failure must occur in the resin of the reversible coating.

Claims22

Dependent claims

A method of adhesive bonding comprising:

preparing a crosslinkable resin depositable by electrostatic powder deposition, and wherein the crosslinkable resin possesses exchangeable bonds within the crosslinkable resin after curing;
depositing the crosslinkable resin by electrostatic powder deposition onto substrates to define crosslinkable resin coated portion of the substrates;
bonding the crosslinkable resin coated portions of the substrates by abutting the crosslinkable resin coated portions of the substrates to each other and applying a compressive pressure in the range 100 kPa 20 MPa at an elevated temperature in the range of 150° C. to 420° C. such that the crosslinkable resin coated portions of the substrates crosslinks with itself across the crosslinkable resin coated portions of the substrates to create a bonded cured resin surface;
and
wherein the bonded cured resin surface possesses at least 4 wt % exchangeable sites within the crosslinks of the bonded cured resin surface.

2 more elements

A method of reversibly adhesive bonding comprising:

preparing a crosslinkable resin depositable by electrostatic powder deposition, and wherein the crosslinkable resin possesses exchangeable bonds within the crosslinkable resin after curing;
depositing the crosslinkable resin by electrostatic powder deposition onto substrates to define crosslinkable resin coated portion of the substrates;
abutting the crosslinkable resin coated portions of the substrates to each other and applying a compressive force in the range 100 kPa to 20 MPa at an elevated temperature in the range of 150° C. to 420° C. such that the crosslinkable resin coated portions of the substrates crosslinks with itself across the crosslinkable resin coated portions of the substrates to create a bonded cured resin surface;
and
wherein the bonded cured resin surface possesses at least 4 wt % exchangeable sites within the crosslinks of the bonded cured resin surface;
debonding the bonded cured resin surface by tensile and/or shear pressure in the range 100 kPa to 55 MPa, and wherein a cohesive failure across the bonded cured resin surface is accomplished by roughing the crosslinkable resin coated portion of the substrates by grit blasting, electrochemical etching, or laser ablation prior to bonding.

3 more elements

Dependencies are inferred from the claim text.

Method For Reversible Bonding

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Method For Reversible Bonding

Life of this patent

Abstract

Claims22