Microfabricated device with piezoelectric substrate and method of manufacture
AssigneeInnovative Micro Technology
InventorChristopher S. GUDEMAN
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Abstract
Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second piezoelectric substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The second piezoelectric substrate may include lithium tantalate (LiTaO3) or lithium niobate (LiNiO3) or lead zirconate titanate (Pb[Zr(x)Ti(1−x)]O3), or integrated circuits formed thereon.
Claims21
A microfabricated structure, comprising:
- a first silicon substrate bonded to a second substrate with an adhesive bond;
- wherein the silicon substrate and second substrate define a device cavity formed therebetween;
- and
- at least one device microfabricated on at least one of the MEMS silicon substrate and second substrate and disposed in the device cavity, wherein the second substrate also comprises a piezoelectric substrate material.
A method for forming a microdevice with a MEMS silicon substrate and a composite piezoelectric substrate, comprising:
- microfabricating at least one device on at least one of the MEMS silicon substrate and the composite piezoelectric substrate;
- applying an adhesive substance to at least one of the MEMS silicon substrate and the composite piezoelectric substrate;
- bonding the MEMS silicon substrate to the composite piezoelectric substrate using the adhesive substance to form a wafer pair;
- and
- dicing the wafer pair to separate the devices.
Dependencies are inferred from the claim text.