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US 2019/0203003 A1Published application
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
AssigneeTaiwan Union Technology Corporation
InventorsCHIH-WEI LIAO, GUAN-SYUN TSENG, TSUNG-HSIEN LIN, JU-MING HUANG, CHEN-HUA YU
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Abstract
A resin composition is provided. The resin composition comprises the following components: (A) a halogen-free epoxy resin; (B) a hardener; and (C) a phosphorus-containing phenolic resin of the following formula (I): wherein m, n, 1, R1, and R2 are as defined in the specification.
Claims20
A resin composition, comprising:
- (A) a halogen-free epoxy resin;
- (B) a hardener;
- and
- (C) a phosphorus-containing phenolic resin of formula (I):
- in formula (I),
- n, m and 1 are independently an integer of 0 to 10, with the proviso that at least one of n, m and 1 is not 0;
- and
- R1 and R2 are independently a residue of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO), a residue of DOPO's derivative, a residue of amino triazine novolac (ATN) resin, or —O(CH2)3CH3, with the proviso that at least one of R1 and R2 is a residue of DOPO or a residue of DOPO's derivative .
5 more elements
Dependencies are inferred from the claim text.