Metallic microneedles
AssigneeMicrodermics Inc.
InventorsBoris STOEBER, Iman MANSOOR, Urs Otto HÄFELI
Life of this patent
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Abstract
Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Claims29
A method for fabricating microneedles, the method comprising:
- fabricating a mold pillar;
- forming one or more coating layers on the mold-pillar, the one or more coating layers comprising an electrically-conductive polymer layer;
- and
- depositing a metal layer over the electrically-conductive polymer layer to provide a first microneedle;
- wherein, after forming the one or more coating layers on the mold pillar, a thickness of the one or more coating layers which coat the mold pillar is relatively thick in regions closer to the substrate and relatively thin in regions more distal from the substrate.
Dependencies are inferred from the claim text.