Chip-placing method performing an image alignment for chip placement and chip-placing apparatus thereof

A chip-placing apparatus, comprising:

• a chip-placing device including a chip-placing member and a marking member adjacent to the chip-placing member, in which the chip-placing member is operated to suck a chip and performs a chip placement;
• a reference-image capturing device configured to capture an image of the marking member from an opposite direction of the chip-placing device, and to capture an image of the chip sucked by the chip-placing member;
• an alignment-image capture device configured to capture, from a backside of the chip-placing device, an image showing the marking member and a substrate;
• and
• a control system including:
• a positioning unit configured to be in power connection to the chip-placing device;
• a calculating and processing unit configured to be in signal connection to the reference-image capturing device and the alignment-image capture device, the calculating and processing unit obtaining a relative position information of the chip in relation to the marking member according to the image(s) captured by the reference-image capturing device, the calculating and processing unit obtaining a relative position information of the marking member in relation to the substrate according to the image captured by the alignment-image capture device, the calculating and processing unit calculating a position calibration relationship information of the position of the chip sucked by the chip-placing member in relation to a to-be-placed location of the substrate according to the relative position information of the chip in relation to the marking member and according to the relative position information of the marking member in relation to the substrate;
• and
• a calibration adjusting unit configured to be in signal connection to the calculating and processing unit and the positioning unit, the calibration adjusting unit calibrating and adjusting the relative position of the chip-placing member in relation to the to-be-placed location according to the position calibration relationship information so as to align the position of the chip sucked by the chip-placing member with the to-be-placed location.