Multilayer wiring board

Abstract

A multilayer wiring board includes a base substrate including conductor layers and insulating layers formed such that the conductor layers and the insulating layers are laminated alternately and that the conductor layers include a first conductor pattern, an inter-pattern insulating resin layer formed on a surface of the base substrate and including an insulating resin layer and an insulating base material laminated on the insulating resin layer such that resin forming the insulating resin layer is filling gaps formed between portions of the first conductor pattern, and a second conductor pattern formed on an outer layer side of the first conductor pattern such that the inter-pattern insulating resin layer is formed between the first conductor pattern and the second conductor pattern. The base substrate, the inter-pattern insulating resin layer and the second conductor pattern form an antenna portion.

Dependencies are inferred from the claim text.