Back to results
US 2019/0200458 A1Published application
Composite chip component, circuit assembly and electronic apparatus
AssigneeRohm Co., Ltd.
InventorsHiroshi TAMAGAWA, Koichi NIINO, Eiji NUKAGA, Keishi WATANABE
Life of this patent
Estimating the term…
Abstract
The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
Claims18
A chip part, comprising:
- a silicon substrate which has a surface and a side surface;
- and
- an electrode which is formed on the silicon substrate,
- wherein the silicon substrate does not contain a dopant that determines a conductive type thereof.
1 more element
A chip part, comprising:
- a silicon substrate which has a surface and a side surface;
- and
- an electrode which is formed on the silicon substrate,
- wherein a resistance value of the silicon substrate is 100Ω·cm or more.
1 more element
Dependencies are inferred from the claim text.