Higher Density Multi-Component and Serial Packages
AssigneeKemet Electronics Corporation
InventorsJames A. Burk, John Bultitude, Galen W. Miller
Life of this patent
Estimating the term…
Abstract
A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive
Claims33
1-72. (canceled)
A method for forming a high density multi-component package comprising:
- providing at least two electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;
- forming a stack of adjacent said electronic components with at least one;
- attaching adjacent said first external terminations with a first adhesive there between;
- attaching said adjacent electronic components with a second adhesive there between;
- and
- wherein said adjacent electronic components are connected serially.
103-112. (canceled)
Dependencies are inferred from the claim text.