Angle mount mm-wave semiconductor package

A semiconductor package waveguide coupling method, comprising:

• disposing a first semiconductor package on a first substrate that includes a first surface and a transversely opposed second surface;
• and
• disposing a second semiconductor package including at least one communicably coupled mm-wave die on a second substrate, the second substrate including a first surface and a transversely opposed second surface;
• disposing at least one mm-wave launcher on the second substrate, the at least one mm-wave launcher communicably coupled to the mm-wave die;
• disposing at least one waveguide member connection feature on the second substrate, the at least one waveguide member connection feature to accommodate the operable and conductive coupling of a waveguide member to the second semiconductor package proximate the at least one mm-wave launcher;
• communicably coupling the first semiconductor package to the second semiconductor package;
• and
• operably coupling the second substrate to the first substrate.

A semiconductor package waveguide coupling system, comprising:

• a means for disposing a first semiconductor package on a first substrate that includes a first surface and a transversely opposed second surface;
• and
• a means for disposing a second semiconductor package including at least one communicably coupled mm-wave die on a second substrate, the second substrate including a first surface and a transversely opposed second surface;
• a means for disposing at least one mm-wave launcher on the second substrate, the at least one mm-wave launcher communicably coupled to the mm-wave die;
• a means for disposing at least one waveguide member connection feature on the second substrate, the at least one waveguide member connection feature to accommodate the operable and conductive coupling of a waveguide member to the second semiconductor package proximate the at least one mm-wave launcher;
• a means for communicably coupling the first semiconductor package to the second semiconductor package;
• and
• a means for operably coupling the second substrate to the first substrate.