Circuit board, connector assembly and cable harness

A circuit board for electrically connecting between a first connecting object and a second connecting object, wherein:

• the circuit board comprises at least a first wiring layer, a second wiring layer and a via;
• the first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions;
• the first ends are configured to be connected with the first connecting object;
• the second ends are configured to be connected with the second connecting object;
• the coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion;
• the inner trace portion and the outer trace portion are connected between the first coupling points and the second coupling points, respectively;
• the inner trace portion has a length equal to a length of the outer trace portion;
• the ground conductor portion is arranged between the inner trace portion and the outer trace portion;
• the first trace portions connect between the first ends and the first coupling points, respectively;
• the first trace portions have lengths equal to each other;
• the first trace portions extend parallel to each other with a first trace distance left therebetween;
• the first trace portions start to extend from the first coupling points, respectively, in a predetermined direction;
• the second trace portions connect between the second ends and the second coupling points, respectively;
• the second trace portions have lengths equal to each other;
• the second trace portions extend parallel to each other with a second trace distance left therebetween;
• the second trace portions start to extend from the second coupling points, respectively, in a direction intersecting with the predetermined direction;
• the second wiring layer is formed with a ground pattern;
• and
• the ground conductor portion is connected with the ground pattern through the via.