Camera device
AssigneesTriple Win Technology(Shenzhen) Co.Ltd., Hon Hai Precision Industry Co., Ltd.
InventorsXIAO-MEI MA, SHIN-WEN CHEN, SHENG-JIE DING
Life of this patent
Estimating the term…
Abstract
A small-scale camera device with heat-dissipating properties includes a pedestal bracket and a camera module mounted on the pedestal bracket. The pedestal bracket includes a top plate and a side plate extending perpendicularly from edges of the top plate. The side plate includes an inner side surface and an outer side surface opposite to the inner side surface. The bottom of the side plate defines a plurality of first receiving recesses, each of the first receiving recesses carries a heat dissipation member.
Claims16
A camera device, comprising:
- a printed circuit board;
- a pedestal bracket mounted on the printed circuit board, and a camera module mounted on the pedestal bracket;
- the camera device further comprises an imaging sensor chip mounted on the printed circuit board;
- the pedestal bracket comprises a receiving space;
- and the imaging sensor chip is accommodated in the receiving space;
- wherein the pedestal bracket comprises a plurality of first receiving recesses, each of the first receiving recess is arranged with a heat dissipation member, each heat dissipation member comprises two opposite surfaces, one surface is exposed in the receiving space, the other surface is exposed outside of the pedestal bracket.
A camera device, comprising:
- a printed circuit board comprising at least one grounding pad formed edges thereon;
- a pedestal bracket being mounted on the printed board;
- wherein the pedestal bracket comprises a top plate and a side plate extending perpendicularly from edges of the top plate, the side plate defines a receiving recess thereon, each of the first receiving recess is arranged with a metal member, a location of the metal member is aligned with the at least one grounding pad;
- a camera module mounted on the pedestal bracket;
- wherein the camera module comprises a metal shell;
- and
- a first conductive adhesive and a second conductive adhesive, wherein the first conductive adhesive is formed on the top plate and contacted with top end of the metal member, and the second conductive adhesive is formed on the at least one grounding pad, and the metal shell is electrically connected to the grounding pad via the first conductive adhesive, the metal member and the second conductive adhesive.
Dependencies are inferred from the claim text.