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US 2019/0199319 A1Published application
Resonator package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsTae Yoon KIM, Yeong Gyu LEE, Moon Chul LEE, Jae Chang LEE, Duck Hwan KIM
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Abstract
A resonator package and a method of manufacturing the same are provided. The method of manufacturing a resonator package involves etching a lower electrode with a hardmask, in which only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
Claims10
A method of manufacturing a resonator package, the method comprising:
- etching a lower electrode with a hardmask,
- wherein only a portion of a thickness of the lower electrode is etched to shape the lower electrode.
A method of manufacturing a resonator package, the method comprising:
- etching a first metal layer disposed on a piezoelectric layer according to at least two shapes to obtain a first electrode;
- and
- forming a dielectric layer on the first electrode,
- wherein the dielectric layer covers a sidewall of the first electrode,
1 more element
Dependencies are inferred from the claim text.