Selectively shielding radio frequency module with multi-layer antenna

A packaged radio frequency module comprising:

• a package substrate having a first side and a second side, the first side opposing the second side;
• a radio frequency component on the first side of the package substrate;
• a multi-layer antenna including a first portion on the first side of the package substrate and a second portion on the second side of the package substrate, the first portion electrically connected to the second portion;
• and
• a shielding layer located such that the radio frequency component is shielded by the shielding layer and the multi-layer antenna is unshielded by the shielding layer, the radio frequency component positioned between the shielding layer and the package substrate.

A packaged radio frequency module comprising:

• a radio frequency component on a first side of a package substrate;
• a multi-layer antenna on the first side of the package substrate, the multi-layer antenna including a first portion and a second portion, the first portion electrically connected to the second portion;
• molding material over the radio frequency component and the first portion of the antenna, the second portion of the antenna located over the molding material;
• and
• a shielding layer located such that the radio frequency component is shielded by the shielding layer and the multi-layer antenna is unshielded by the shielding layer, the radio frequency component positioned between the shielding layer and the package substrate.