Semiconductor package structure having antenna module
AssigneeSJ Semiconductor(Jiangyin) Corporation
InventorsYenheng CHEN, Chentar WU, Chengchung LIN
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Abstract
A semiconductor package structure having an antenna module includes: a substrate, having a first surface, a second surface, and at least one via hole made by a laser running through the substrate; a rewiring layer, disposed on the first surface of the substrate; metal bumps, disposed on the rewiring layer and electrically connected to the rewiring layer; a semiconductor chip, disposed on and electrically connected to the rewiring layer; a conductive column, filling the via hole, and an antenna module, disposed on the second surface of the substrate and electrically connected to the metal bumps through the conductive column and the rewiring layer.
Claims13
A semiconductor package structure having an antenna module, comprising:
- a substrate, having a first surface and a second surface opposite to the first surface, wherein at least one via hole running through the first surface and the second surface is formed in the substrate;
- a rewiring layer, disposed on the first surface of the substrate;
- a plurality of metal bumps, disposed on and electrically connected to the rewiring layer;
- a semiconductor chip, disposed on and electrically connected to the rewiring layer, wherein a lateral space is configured between the semiconductor chip and each of the plurality of metal bumps;
- a conductive column, filling the via hole;
- and
- an antenna module, disposed on the second surface of the substrate, wherein the antenna module is electrically connected to the plurality of metal bumps through the conductive columns and the rewiring layer.
Dependencies are inferred from the claim text.