Semiconductor package structure having antenna module
AssigneeSJ Semiconductor(Jiangyin) Corporation
InventorsYenheng CHEN, Chentar WU, Chengchung LIN
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Abstract
A semiconductor package structure having an antenna module includes: a substrate, having at least one via hole running through the substrate; a rewiring layer, disposed on a surface of the substrate; a metal bump, disposed on and electrically connected to the rewiring layer; a semiconductor chip, disposed on and electrically connected to the rewiring layer; a conductive column, filling the via hole; a plastic packaging material layer, surrounding the metal bump and the semiconductor chip; and an antenna module, electrically connected to the metal bump through the conductive column and the rewiring layer.
Claims11
A semiconductor package structure having an antenna module, comprising:
- a substrate, having a first surface and a second surface opposite to the first surface, wherein at least one via hole is formed through the substrate from the first surface to the second surface;
- a rewiring layer, disposed on the first surface of the substrate;
- a metal bump, disposed on and electrically connected to the rewiring layer;
- a semiconductor chip, disposed on and electrically connected to the rewiring layer, wherein a space is arranged between the semiconductor chip and the metal bump;
- a conductive column, filling the via hole;
- a plastic packaging material layer, disposed on the rewiring layer, embedding the metal bump and the semiconductor chip except leaving a top part of the metal bump and a top part of the semiconductor chip exposed;
- and
- an antenna module, disposed on the second surface of the substrate, wherein the antenna module is electrically connected to the metal bump through the conductive column and the rewiring layer.
Dependencies are inferred from the claim text.