Package structure of organic light emitting component and method fof manufacturing the same
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorHui HUANG
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AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorHui HUANG
Estimating the term…
The present disclosure provides a package structure of an organic light emitting component and a method for manufacturing the same. The package structure includes: a substrate, provided with light emitting pixels; a first barrier layer, arranged on the substrate; a nanoparticle layer, arranged on a portion of the first barrier layer corresponding to a location of the light emitting pixels, wherein the nanoparticle layer is configured to extract light from the light emitting pixels; a buffer layer, arranged on another portion of the first barrier layer where the nanoparticle layer is not set; a second barrier layer, arranged on the nanoparticle layer and the buffer layer. The implementation of the present disclosure allows the light extraction to be applied only on the light emitting pixels. Therefore, it can avoid the waste of material and reduce production cost.
A method for manufacturing a package structure of an organic light emitting component, comprising:
A package structure of an organic light emitting component, comprising:
A method for manufacturing a package structure of an organic light emitting component, comprising:
Dependencies are inferred from the claim text.