Package structure, manufacturing method for the same, and display device
AssigneesChengdu Boe Optoelectronics Technology Co., Ltd., Boe Technology Group Co., Ltd.
InventorLin GE
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Abstract
The present disclosure provides a package structure, a manufacturing method for the same, and a display device. The package structure includes a substrate, an organic light emitting device disposed on the substrate, and an encapsulation film layer disposed above the organic light emitting device, the encapsulation film layer encapsulating the organic light emitting device onto the substrate, wherein an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
Claims20
A package structure, comprising:
- a substrate;
- an organic light emitting device disposed on the substrate;
- an encapsulation film layer disposed above the organic light emitting device, the encapsulation film layer encapsulating the organic light emitting device onto the substrate,
- wherein an adsorption structure is formed in the encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
A manufacturing method for a package structure, wherein the package structure comprises a substrate, an organic light emitting device, and a first encapsulation film layer, the manufacturing method comprising:
- forming the organic light emitting device on the substrate;
- forming the first encapsulation film layer above the organic light emitting device to encapsulate the organic light emitting device onto the substrate,
- wherein an adsorption structure is formed in the first encapsulation film layer, and the adsorption structure is configured to absorb moisture and oxygen.
Dependencies are inferred from the claim text.