Semiconductor light-emitting device and method for producing same
AssigneeStanley Electric Co., Ltd.
InventorKenji IKEDA
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Abstract
A semiconductor light-emitting device capable of suppressing the influence of thermal expansion on a light-emitting element during operation of the device and improving light-emitting characteristics is provided. The semiconductor light-emitting device includes: a substrate having a through hole, a metal core fitted into the through hole via a resin layer and penetrating through the substrate; a thermally-conductive film formed in the region of the upper surface of the metal core and having a flat surface; and a semiconductor light-emitting element bonded to the flat surface of the thermally-conductive film with an adhesive layer interposed therebetween. The outer edge of the thermally-conductive film is separated from the outer edge of the upper surface of the metal core.
Claims17
A semiconductor light-emitting device comprising:
- a substrate having a through hole formed therein;
- a metal core which is fitted into the through hole formed in the substrate via a resin layer and penetrates through the substrate, the metal core having an upper surface;
- a thermally-conductive film which is formed in a region of the upper surface of the metal core, the thermally-conductive film having a flat surface;
- and
- a semiconductor light-emitting element which is bonded to the flat surface of the thermally-conductive film with an adhesive layer interposed therebetween, wherein
- an outer edge of the thermally-conductive film is separated from an outer edge of the upper surface of the metal core.
A method for producing a semiconductor light-emitting device comprising:
- a first step of forming a through hole in a substrate;
- a second step of fitting and fixing a metal core to the through hole via a resin layer;
- a third step of forming a thermally-conductive film in a region of an upper surface of the metal core, the thermally-conductive film having a flat surface;
- and
- a fourth step of bonding a semiconductor light-emitting element to the flat surface of the thermally-conductive film.
Dependencies are inferred from the claim text.