Resin package and semiconductor light-emitting device

A resin package having first side surfaces in a longitudinal direction of the resin package and second side surfaces located between the first side surfaces, comprising:

• a cavity having a cavity bottom surface;
• a printed circuit board having a board top surface and a board bottom surface including a resin layer, a first metallic layer and a second metallic layer, and the board top surface of the printed circuit board being used as the cavity bottom surface of the cavity,
• the resin layer having a resin top surface and a resin bottom surface including a first through hole, a second through hole and third through holes,
• the first metallic layer having a first top metallic thickness formed on the resin top surface of the resin layer, the first top metallic thickness located between the resin top surface and the board top surface of the printed circuit board, the first metallic layer having a first bottom metallic thickness formed underneath the resin bottom surface of the resin layer, the first bottom metallic thickness located between the resin bottom surface and the board bottom surface of the printed circuit board, the first metallic layer having the first top metallic thickness electrically connecting to the first metallic layer having the first bottom metallic thickness via the first through hole of the resin layer, and
• the second metallic layer having a second top metallic thickness formed on the resin top surface of the resin layer, the second top metallic thickness located between the resin top surface and the board top surface of the printed circuit board, the second metallic layer having a second bottom metallic thickness formed underneath the resin bottom surface of the resin layer, the second bottom metallic thickness located between the resin bottom surface and the board bottom surface of the printed circuit board, the second metallic layer having the second top metallic thickness electrically connecting to the second metallic layer having the second bottom metallic thickness via the first through hole of the resin layer, wherein each of the first metallic layer and the second metallic layer being electrically isolated with respect to each other;
• a frame having a frame top surface surrounded by the first side surfaces and the second side surfaces, and including a frame cavity layer and a frame bottom layer, the frame cavity layer formed between the first top metallic thickness of the first metallic layer and the second top metallic thickness of the second metallic layer in the cavity, the frame cavity layer being used as the cavity bottom surface of the cavity along with the board top surface of the printed circuit board, the frame connecting to the frame cavity layer and to the frame bottom layer from the frame top surface via the third through holes of the resin layer;
• and wherein each of the third through holes of the resin layer is located adjacent to a respective one of the first side surfaces of the resin packages, and the frame bottom layer is disposed so as to be surrounded by the respective one of the first side surfaces of the resin packages and either the first metallic layer or the second metallic layer, which are disposed underneath the resin bottom surface of the resin layer.