Solid-state imaging device, manufacturing method thereof, and electronic apparatus
AssigneeSony Corporation
InventorYosuke Ogata
Life of this patent
Estimating the term…
Abstract
Disclosed is a solid-state imaging device including: a solid-state imaging element which outputs an image signal according to an amount of light sensed on a light sensing surface; a semiconductor element which performs signal processing with respect to the image signal output from the solid-state imaging element; and a substrate which is electrically connected to the solid-state imaging element and the semiconductor element, in which the semiconductor element is sealed by a molding resin in a state of being accommodated in an accommodation area which is provided on the substrate, and in which the solid-state imaging element is layered on the semiconductor element via the molding resin.
Claims20
A camera module, comprising:
- a lens;
- a lens holder configured to hold the lens;
- a solid-state imaging element configured to receive light through the lens;
- a first substrate electrically connected to the solid-state imaging element via bonding wires and configured to receive an image signal output from the solid-state imaging element;
- and
- a second substrate electrically connected to the solid-state imaging element and the first substrate, wherein the solid-state imaging element is disposed above the second substrate, wherein the lens holder is attached to the second substrate via a first material,
- wherein the bonding wires are sealed by a second material in contact with the solid-state imaging element and the first substrate.
A camera module, comprising:
- a lens;
- a lens holder configured to hold the lens;
- a solid-state imaging element configured to receive light through the lens;
- a first substrate electrically connected to the solid-state imaging element via a connecting portion and configured to receive an image signal output from the solid-state imaging element;
- and
- a second substrate electrically connected to the solid-state imaging element and the first substrate via the connecting portion, wherein the solid-state imaging element is disposed above the second substrate, wherein the lens holder is attached to the second substrate via a first material,
- wherein the connecting portion comprises bonding wires, and
- wherein at least a part of the connecting portion is sealed by a second material in contact with the solid-state imaging element and the first substrate.
Dependencies are inferred from the claim text.