Imaging device
AssigneeNikon Corporation
InventorTakafumi KOMABA
Life of this patent
Estimating the term…
Abstract
An image sensor having a pixel part generating a signal in accordance with a light, a signal processing part performing signal processing on the signal read from the pixel part, and a power supply part connected to the signal processing part via a first wiring, and supplying a power supply to the signal processing part, and a storage package storing the image sensor, and having a second wiring configuring a parallel circuit by being connected to the first wiring. Accordingly, it is possible to solve a problem such that a wiring resistance is increased when a power supply circuit is configured inside of a solid state image sensor.
Claims15
An imaging device comprising:
- an image sensor which has a first signal line connected to a first pixel;
- a second signal line connected to a second pixel;
- a first signal processing circuit connected to the first signal line and performing signal processing on an input signal;
- a second signal processing circuit connected to the second signal line and performing signal processing on an input signal;
- and a first wiring connecting between a first pad and a second pad, and to provide a voltage from a power supply circuit to the first signal processing circuit and the second signal processing circuit in between the first pad and the second pad;
- and
- a substrate being arranged with the image sensor and having a second wiring to be connected to the first pad and the second pad.
An image sensor comprising
- a first signal line connected to a first pixel;
- a second signal line connected to a second pixel;
- a first signal processing circuit connected to the first signal line and performing signal processing on an input signal;
- a second signal processing circuit connected to the second signal line and performing signal processing on an input signal;
- and a first wiring connecting between a first pad and a second pad, and to provide a voltage from a power supply circuit to the first signal processing circuit and the second signal processing circuit in between the first pad and the second pad, wherein
- the first wiring is connected to a second wiring, provided on outside, via the first pad and the second pad.
Dependencies are inferred from the claim text.