Semiconductor memory
AssigneeToshiba Memory Corporation
InventorHideto TAKEKIDA
Life of this patent
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Abstract
According to one embodiment, a semiconductor memory includes a plurality of conductors stacked with insulators being interposed therebetween and a pillar through the plurality of conductors. The pillar includes a first columnar section, a second columnar section, and a joint portion between the first columnar section and the second columnar section. The pillar comprises portions that cross the respective conductors and that each function as part of a transistor. The plurality of conductors include a first conductor. The first conductor is closest to the joint portion among the plurality of conductors through the second columnar section, and includes a bending portion formed along the joint portion.
Claims23
A semiconductor memory comprising:
- a plurality of conductors stacked with insulators being interposed therebetween;
- and
- a pillar through the plurality of conductors, the pillar including a first columnar section, a second columnar section above the first columnar section, and a joint portion between the first columnar section and the second columnar section, and the pillar comprising portions that cross the respective conductors and that each function as part of a transistor,
- wherein the plurality of conductors include a first conductor that is closest to the joint portion among the plurality of conductors through the second columnar section, and the first conductor includes a bending portion formed along the joint portion.
A semiconductor memory comprising:
- a plurality of conductors stacked with insulators being interposed therebetween;
- and
- a pillar through the plurality of conductors, the pillar including a first columnar section and a second columnar section on the first columnar section, and the pillar comprising portions that cross the respective conductors and that each function as part of a transistor,
- wherein the plurality of conductors include a first conductor that is closest to the first columnar section among the plurality of conductors through the second columnar section, and the first conductor includes a bending portion formed along the first columnar section.
A semiconductor memory comprising:
- a plurality of conductors stacked with insulators being interposed therebetween;
- and
- a plurality of pillars each passing through the plurality of conductors, the pillars each including a first columnar section, and a second columnar section above the first columnar section, the pillars each comprising portions that cross the respective conductors and that each function as part of a transistor, wherein
- the plurality of conductors include a first conductor among the plurality of conductors through the second columnar section,
- the plurality of pillars include a first pillar and a second pillar adjacent to each other, and
- a first distance, in a stacking direction of the plurality of conductors, between a substrate and an upper end of the first conductor at a position between the first and second pillars is smaller than a second distance in the stacking direction between the substrate and an upper end of a portion where the first conductor comes into contact with the first pillar.
Dependencies are inferred from the claim text.