Semiconductor device for enhancing electrostatic discharge protection and layout structure thereof
AssigneeCsmc Technologies Fab2 Co., Ltd.
InventorGuangyang WANG
Life of this patent
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Abstract
A semiconductor device for enhancing electrostatic discharge (ESD) protection and a layout structure thereof are provided. An ESD protection device and a protected device (300) with a small feature linewidth are located on the same well region. The device (300) with the small feature linewidth is located at a middle portion. The ESD protection device is disposed at both sides of the device (300) with the small feature linewidth.
Claims16
A semiconductor device for enhancing electrostatic discharge protection, comprising:
- an electrostatic discharge protection device;
- and
- a device with small feature linewidth, located on the same well region as the electrostatic discharge protection device, the device with small feature linewidth being located at a middle portion, and the electrostatic discharge protection device being disposed on both sides of the device with small feature linewidth.
A layout structure of a semiconductor device for enhancing electrostatic discharge protection, and the semiconductor device comprising:
- an electrostatic discharge protection device;
- and
- a device with small feature linewidth located on same well region as the electrostatic discharge protection device, the device with small feature linewidth being located at a middle portion, and the electrostatic discharge protection device being disposed on both sides of the device with small feature linewidth;
- and the layout structure comprising:
- a plurality of gate polysilicon including a gate of the electrostatic discharge protection device and a gate of the device with small feature linewidth, each gate polysilicon having a long strip structure, and respective gate polysilicon being arranged in lateral direction at intervals, wherein width direction of the gate polysilicon is the lateral direction;
- a plurality of N type doping regions disposing between adjacent, acting as a N type source region of the electrostatic discharge protection device and a N type drain region of the electrostatic discharge protection device arranged in lateral direction at intervals;
- a metal layer comprising:
- a first metal layer forming as interdigitated structure, and being configured to connect the N type source region of the electrostatic discharge protection device with a N type source region of the device with small feature linewidth;
- and
- a second metal layer forming as interdigitated structure, and being configured to connect the N type drain region of the electrostatic discharge protection device with N type drain region of the device with small feature linewidth.
Dependencies are inferred from the claim text.