Electronic package unit and manufacturing method thereof and electronic device

An electronic package unit cooperated with a driving circuit board, the electronic package unit comprising:

• an insulation substrate having a first surface and a second surface opposite to the first surface, wherein the insulation substrate comprises a plurality of through-holes;
• a sub-matrix circuit disposed on the insulation substrate, wherein the sub-matrix circuit comprises at least one thin film transistor;
• at least a functional chip disposed on the first surface, wherein the functional chip is electrically connected with the driving circuit board through the sub-matrix circuit and the through-holes;
• and
• a protection layer disposed on the first surface of the insulation substrate to cover the functional chip.

An electronic device, comprising:

• a plurality of electronic package units, wherein each of the electronic package units comprises:
• an insulation substrate having a first surface and a second surface opposite to the first surface, wherein the insulation substrate comprises a plurality of through-holes,
• at least a sub-matrix circuit disposed on the insulation substrate, wherein the sub-matrix circuit comprises at least one thin film transistor,
• at least a functional chip disposed on the first surface of the insulation substrate, and
• a protection layer disposed on the first surface of the insulation substrate to cover the functional chip;
• and
• a driving circuit board facing the second surface of the insulation substrate, wherein the functional chips are electrically connected to the driving circuit board through the sub-matrix circuits and the through-holes, respectively.