Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorAkito SHIMIZU
Life of this patent
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Abstract
A semiconductor device includes a first supporting body, a first adhesive body, a first chip, a second adhesive body, a second chip, and a resin sealing member. The first adhesive body is provided on the first supporting body. The first chip includes an integrated circuit, and is provided on the first adhesive body. The second adhesive body is provided on the first chip. The second chip is provided on the second adhesive body. A coefficient of linear expansion of the second chip is not less than −75% and not more than +50% of that of the first chip. A thickness of the second chip is not less than 0.3 times and not more than 1.7 times of that of the first chip. The resin sealing member is provided around the first supporting body, the first and second adhesive bodies, and the first and second chip.
Claims20
A semiconductor device, comprising:
- a first supporting body;
- a first adhesive body provided on the first supporting body;
- a first chip including an integrated circuit, the first chip being provided on the first adhesive body;
- a second adhesive body provided on the first chip;
- a second chip provided on the second adhesive body, a coefficient of linear expansion of the second chip being not less than −75% and not more than +50% of a coefficient of linear expansion of the first chip, a thickness of the second chip in a first direction from the first chip toward the second adhesive body being not less than 0.3 times and not more than 1.7 times of a thickness of the first chip in the first direction;
- and
- a resin sealing member provided around the first supporting body, the first adhesive body, the first chip, the second adhesive body and the second chip.
Dependencies are inferred from the claim text.