Integrated circuit die having backside passive components and methods associated therewith
AssigneeIntel Corporation
InventorKevin J. LEE
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure are directed towards an integrated circuit (IC) die. In embodiments, the IC die may include a semiconductor substrate, a plurality of active components disposed on a first side of the semiconductor substrate, and a plurality of passive components disposed on a second side of the semiconductor substrate. In embodiments the second side may be disposed opposite the first side. The passive components may, in some embodiments, include capacitors and/or resistors while the active components may, in some embodiments, include transistors. Other embodiments may be described and/or claimed.
Claims21
1-15. (canceled)
A method of forming an integrated circuit (IC) die assembly comprising:
- providing a semiconductor substrate;
- forming a plurality of active components on a first side of the semiconductor substrate;
- forming a plurality of passive components on a second side of the semiconductor substrate, wherein the second side of the semiconductor substrate is disposed opposite the first side of the semiconductor substrate.
An integrated circuit (IC) package assembly comprising:
- an integrated circuit (IC) die having:
- a plurality of active components disposed on a first side of a semiconductor substrate;
- a plurality of passive components disposed on a second side of the semiconductor substrate, wherein the second side of the semiconductor substrate is disposed opposite the first side of the semiconductor substrate;
- a first plurality of input/output (I/O) interconnect structures electrically coupled with the plurality of active components;
- and
- a second plurality of I/O interconnect structures electrically coupled with the plurality of passive components;
- and
- a package substrate electrically coupled with the IC die, wherein the package substrate is configured to route electrical signals of the IC die.
Dependencies are inferred from the claim text.