Back to results
US 2019/0198480 A1Published application
Dual-sided memory module with channels aligned in opposition
AssigneeApple Inc.
InventorsJames D. Kelly, William H. Radke, Steven J. Sfarzo
Life of this patent
Estimating the term…
Abstract
Memory packages, memory modules, and circuit boards are described. In an embodiment, single channel memory packages are mounted on opposite sides of a circuit board designed with a first side also designed to accept dual channel memory packages. Alternatively, dual channel memory packages may be mounted on a first side of a circuit board that is also designed to accept single channel packages on opposite sides.
Claims18
(canceled)
A memory module comprising:
- a circuit board comprising:
- a first side including a first package landing area including a first landing pad section and a second landing pad section;
- a second side opposite the first side, the second side including a second package landing area including a third landing pad section opposite the second landing pad section and a fourth landing pad section opposite the first landing pad section;
- a first plurality of interconnects electrically connecting power landing pads contained in the first landing pad section and the fourth landing pad section;
- and
- a second plurality of interconnects electrically connecting power landing pads and signal landing pads contained in the second landing pad section and the third landing pad section;
- wherein the second plurality of interconnects is greater than the first plurality of interconnects;
- and
- a first memory package mounted onto the first and second landing pad sections.
6 more elements
Dependencies are inferred from the claim text.