Back to results
US 2019/0198479 A1Published application
Semiconductor device including optically connected wafer stack
AssigneeSanDisk Information Technology (Shanghai) Co., Ltd.
InventorsChin-Tien Chiu, Ye Bai, Shineng Ma, Ting Liu, Binbin Zheng, Lei Shi, Hem Takiar
Life of this patent
Estimating the term…
Abstract
A semiconductor device is disclosed including a stack of wafers having a densely configured 3D array of memory die. The memory die on each wafer may be arranged in clusters, with each cluster including an optical module providing an optical interconnection for the transfer of data to and from each cluster.
Claims30
A semiconductor device, comprising:
- one or more undiced semiconductor wafers, each wafer of the one or more semiconductor wafers processed to include a plurality of semiconductor die, each wafer of the one or more wafers further comprising a plurality of cavities ;
- and
- a plurality of optical modules mounted in the plurality of cavities, the plurality of optical modules configured to transfer data to and from the plurality of semiconductor die on the one or more wafers using light signals.
(canceled)
A semiconductor device, comprising:
- a plurality of stacked wafers, each wafer comprising:
- a plurality of semiconductor die processed into the wafer;
- a plurality of cavities;
- and
- a plurality of optical modules mounted in the plurality of cavities and configured to transfer data to and from the plurality of semiconductor die using light signals.
2 more elements
A semiconductor device, comprising:
- a plurality of stacked wafers;
- a plurality of semiconductor die processed into the plurality of stacked wafers;
- a plurality of cavities in the plurality of stacked wafers;
- and
- a plurality of optical modules in the plurality of cavities of different wafers, the plurality of optical modules configured to transfer light signals to each other through the plurality of stacked wafers.
2 more elements
A semiconductor device, comprising:
- a plurality of stacked wafers, each wafer comprising:
- a plurality of semiconductor die processed in clusters into the wafer;
- a plurality of cavities, one cavity in each cluster on the wafer;
- a plurality of optical modules, one optical module mounted in each of the plurality of cavities, and configured to transfer data to and from the plurality of semiconductor die using light signals;
- and
- a plurality of controller die, one controller die mounted in each of the plurality of cavities, and configured to control the transfer of data to and from the plurality of semiconductor die.
3 more elements
A semiconductor device, comprising:
- a plurality of stacked wafers, each wafer comprising:
- a plurality of semiconductor die processed into the wafer comprising cavity means;
- optical signal transmission means, mounted in the cavity means, for transmitting signals along an axis perpendicular to a surface of the wafers;
- and
- controller means for controlling the transfer of data to and from the plurality of semiconductor die.
2 more elements
Dependencies are inferred from the claim text.