Bonding apparatus and method for using the same
AssigneeSamsung Display Co., Ltd.
InventorsByoung Yong KIM, Jeong Ho HWANG
Life of this patent
Estimating the term…
Abstract
A bonding apparatus for bonding a driving circuit to a display panel includes: a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel; a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit; and a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.
Claims20
A bonding apparatus for bonding a driving circuit to a display panel, the apparatus comprising:
- a bonding stage unit on which the display panel is supported in bonding the driving circuit to the display panel;
- a head unit located above the bonding stage unit and with which ultrasonic waves are applied to the driving circuit to couple the driving circuit with a bonding area of the display panel supported on the bonding stage unit;
- and
- a protrusion disposed at an edge portion of the bonding stage unit, the edge portion corresponding to an end of the display panel at which the bonding area is disposed.
A method for fabricating a display device, the method comprising:
- positioning a display panel of the display device on a bonding stage unit of a bonding apparatus;
- placing a driving circuit of the display device, on a bonding area of the display panel positioned on the bonding stage unit;
- and
- mounting the driving circuit to the bonding area of the display panel by applying a pressure and ultrasonic vibration to the driving circuit on the bonding area, by a head unit of the bonding apparatus which is located above the bonding stage unit,
- wherein the bonding stage unit comprises:
- a first bonding stage on which is supported the bonding area of the display panel positioned on the bonding stage unit, and
- a protrusion at an edge portion of the first bonding stage which corresponds to an end of the display panel at which the bonding area is disposed.
Dependencies are inferred from the claim text.