Back to results
US 2019/0198475 A1Published application
Laser ablation for wire bonding on organic solderability preservative surface
AssigneeContinental Automotive Systems, Inc.
InventorsJared Yagoda, Allyson Beuhler
Life of this patent
Estimating the term…
Abstract
A printed circuit board is disclosed. The printed circuit board includes: a substrate layer; a copper layer disposed on the substrate layer; and an organic solderability preservative (OSP) layer disposed on the copper layer. The OSP layer defines one or more laser treated OSP surfaces.
Claims9
A printed circuit board comprising:
- a substrate layer;
- a copper layer disposed on the substrate layer;
- and
- an organic solderability preservative (OSP) layer disposed on the copper layer;
- the OSP layer defining one or more laser treated OSP surfaces.
2 more elements
A method comprising:
- providing a substrate layer;
- providing a copper layer disposed on the substrate layer;
- providing an organic solderability preservative (OSP) layer disposed on the copper layer;
- exposing a surface of the copper layer by applying a laser beam from a laser on the OSP layer;
- and
- providing a connection between a component and the exposed surface of the copper layer.
3 more elements
Dependencies are inferred from the claim text.