Multiple sized bump bonds
AssigneeInternational Business Machines Corporation
InventorsDavid W. Abraham, John M. Cotte
Life of this patent
Estimating the term…
Abstract
A semiconductor structure and methods for the creation of solder bumps configured to carry a signal and solder bumps configured for ground planes and/or mechanical connections as well as methods for increasing reliability of a chip package generally include formation of multiple sized bump bonds on under bump metallization patterns and/or pads of the same dimension. The signal carrying solder bumps are larger in terms of diameter and bump height than solder bumps configured for ground plane and/or mechanical connections.
Claims12
A semiconductor device, comprising:
- a plurality of under bump metallization (UBM) layers overlying a pad, wherein each one of the UBMs have the same dimension;
- a first solder bump on selected ones of the UBM layers;
- and
- a second solder bump on the other ones of the UBM layers, wherein the first solder bumps have a first diameter (d1) and the second solder bumps have a second diameter (d2), wherein d1 is greater than d2, and wherein the first solder bumps are configured to carry signals between chips and the second solder bumps are configured for mechanical connection and/or ground connections.
A semiconductor device, comprising:
- a plurality of under bump metallization (UBM) layers overlying a pad, wherein each one of the UBMs have the same dimension;
- a first solder bump on selected ones of the UBM layers;
- and
- a second solder bump on the other ones of the UBM layers, wherein the first solder bumps have a bump height (bh1) and the second solder bumps have a bump height (bh2), wherein bh1 is greater than bh2, and wherein the first solder bumps are configured to carry signals between chips and the second solder bumps are configured for mechanical connection and/or ground connections.
10-23. (canceled)
A semiconductor device, comprising:
- one or more solder bumps configured for carrying a signal;
- and
- one or more solder bumps configured for ground plane or mechanical connection, wherein the one or more solder bumps configured for carrying the signal have a greater bump height than the one or more solder bumps configured for ground plane or mechanical connection.
Dependencies are inferred from the claim text.