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US 2019/0198473 A1Published application
Chip structure
AssigneeNovatek Microelectronics Corp.
InventorsLing-Chieh Li, Chiao-Ling Huang
Life of this patent
Estimating the term…
Abstract
A chip structure including a chip body and a plurality of conductive bumps. The chip body includes an active surface and a plurality of bump pads disposed on the active surface. The conductive bumps are disposed on the active surface of the chip body and connected to the bump pads respectively, and at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.
Claims37
A chip structure, comprising:
- a chip body comprising an active surface and a plurality of bump pads disposed on the active surface;
- a plurality of conductive bumps disposed on the active surface of the chip body and connected to the bump pads respectively, wherein at least one of the conductive bumps has a trapezoid shape having one pair of parallel sides and one pair of non-parallel sides.
A chip structure, comprising:
- a chip body comprising an active surface and a plurality of bump pads disposed on a bonding portion of the active surface;
- a plurality of conductive bumps disposed on the bonding portion the active surface and connected to the bump pads respectively, wherein at least one of the conductive bumps comprises one pair of parallel sides and one pair of non-parallel sides, and each of the conductive bumps has a long axis, and the long axis of the conductive bumps cross with one another at a plurality of crossing points.
A chip structure, comprising:
- a chip body comprising an active surface and a plurality of bump pads disposed on the active surface;
- a plurality of conductive bumps disposed on the active surface of the chip body and connected to the bump pads respectively, wherein at least one of the conductive bumps has one pair of parallel sides, and one side of the parallel side has a first width and the other side of the parallel side has a second width longer than the first width.
Dependencies are inferred from the claim text.