Back to results
US 2019/0198469 A1Published application
Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsKuang-Hsiung CHEN, Yu-Hsuan TSAI, Yu-Ying LEE, Sheng-Ming WANG, Wun-Jheng SYU
Life of this patent
Estimating the term…
Abstract
A micro-electromechanical systems (MEMS) package structure includes: (1) a circuit layer; (2) a MEMS die with an active surface, wherein the active surface faces the circuit layer; (3) a conductive pillar adjacent to the MEMS die; and (4) a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.
Claims19
A micro-electromechanical systems (MEMS) package structure, comprising:
- a circuit layer;
- a MEMS die with an active surface, wherein the active surface faces the circuit layer;
- a conductive pillar adjacent to the MEMS die;
- and
- a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar.
2 more elements
A micro-electromechanical systems (MEMS) package structure, comprising:
- a MEMS die;
- a conductive pillar adjacent to the MEMS die;
- a package body encapsulating the MEMS die and the conductive pillar, and exposing a top surface of the conductive pillar;
- and
- a binding layer disposed on the package body and on the top surface of the conductive pillar.
2 more elements
Dependencies are inferred from the claim text.