Semiconductor package structure having antenna module
AssigneeSJ Semiconductor(Jiangyin) Corporation
InventorsYenheng CHEN, Chentar WU, Chengchung LIN
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Abstract
A semiconductor package structure having an antenna module includes: a substrate, having a first surface and a second surface; a semiconductor chip, disposed on the first surface; a plastic packaging material layer, formed on the first surface, where the plastic packaging material layer wraps the semiconductor chip and exposes a part of a front surface of the semiconductor chip; a rewiring layer, disposed on the plastic packaging material layer and electrically connected to the semiconductor chip; a metal bump, electrically connected to the rewiring layer; and an antenna module, disposed on the second surface of the substrate.
Claims11
A semiconductor package structure having an antenna module, comprising:
- a substrate, having a first surface and a second surface opposite to the first surface;
- a semiconductor chip having a front and a back surfaces, disposed with the back surface contacting the first surface of the substrate;
- a plastic packaging material layer, formed on the first surface of the substrate, wherein the plastic packaging material layer embeds the semiconductor chip except leaving a part of the front surface of the semiconductor chip exposed;
- a rewiring layer, disposed on the plastic packaging material layer, wherein the exposed part of the semiconductor chip is electrically connected to the rewiring layer;
- a metal bump, electrically connected to the rewiring layer;
- and
- an antenna module, disposed on the second surface of the substrate.
Dependencies are inferred from the claim text.