US 2019/0198463 A1Published application

Semiconductor device

AssigneeRenesas Electronics Corporation

InventorsShuuichi KARIYAZAKI, Wataru SHIROI, Shinji KATAYAMA, Keita TSUCHIYA

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Abstract

A semiconductor device includes a semiconductor chip including a first circuit and a wiring substrate over which the semiconductor chip is mounted. The wiring substrate includes input signal wires transmitting an input signal to the semiconductor chip, output signal wires transmitting an output signal from the semiconductor chip, and first conductor planes supplied with a reference potential. When a wire cross-sectional area is defined as the cross-sectional area of each wire in a direction orthogonal to a direction in which the wire extends, the wire cross-sectional area of each input signal wire is smaller than the wire cross-sectional area of each output signal wire. In the thickness direction of the wiring substrate, each input signal wire is interposed between second conductor planes and third conductor planes each supplied with the reference potential. Between the output signal wires and the input signal wires, the third conductor planes are disposed.

Claims17

Dependent claims

A semiconductor device, comprising:

a semiconductor chip including a first surface, a second surface opposite to the first surface, a first side, a second side opposite the first side, a first electrode formed on the first surface and a second electrode formed on the first surface;
and
a wiring substrate including a first main surface over which the semiconductor chip is mounted, a second main surface opposite to the first main surface, a first wire for output signals extending in a first direction along the first main surface and located between the first and second main surface, a second wire for input signals extending in the first direction and located closer to the main surface than the first wire in a cross-section view,
wherein the first wire is electrically connected with the first electrode of the semiconductor chip,
wherein the second wire is electrically connected with the second electrode of the semiconductor chip and is located between a first conductor pattern and a second conductor in a cross-section view, and
wherein, when a wire cross-sectional area is defined as the cross-sectional area of each of the first and second wires in a second direction orthogonal to the first direction, the wire cross-sectional area of the second wire is smaller than the wire cross-sectional area of the first wire.

3 more elements

Dependencies are inferred from the claim text.