Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods

A semiconductor apparatus, comprising:

• a semiconductor package having a main surface;
• a radio-frequency line element of the semiconductor package, wherein the radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is configured to provide a signal at a frequency of greater than 10 GHz to a circuit board;
• and
• a protective structure arranged on the main surface of the semiconductor package, wherein the protective structure and a region of the main surface, that is designed to be covered by an underfiller material between the main surface and the circuit board when the semiconductor package is arranged on the circuit board, do not overlap in an orthogonal projection onto the main surface.

A method for manufacturing a semiconductor apparatus, wherein the method comprises:

• arranging a semiconductor package having a main surface on a circuit board;
• and
• depositing an underfiller material on the circuit board,
• wherein the main surface faces the circuit board,
• wherein a radio-frequency line element of the semiconductor package is arranged on the main surface or inside the semiconductor package, the radio-frequency line element being configured to transmit a signal at a frequency of greater than 10 GHz, and
• wherein the underfiller material is arranged between the circuit board and the semiconductor package,
• wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.