Semiconductor package having a metal paint layer

A radio-frequency module comprising:

• a packaging substrate configured to receive a plurality of components;
• one or more radio-frequency components mounted on a surface of the packaging substrate;
• a ground plane disposed below the surface of the packaging substrate;
• a plurality of radio-frequency shielding wirebonds disposed around the one or more RF components and electrically connected to the ground plane;
• an overmold structure formed over the surface of the packaging substrate and dimensioned to substantially encapsulate the one or more radio-frequency components and the radio-frequency shielding wirebonds, the overmold structure defining an upper surface that exposes upper portions of the radio-frequency shielding wirebonds;
• and
• a conductive paint layer disposed on the upper surface of the overmold structure so that the conductive paint layer, the radio-frequency shielding wirebonds, and the ground plane form an radio-frequency shielded volume about the one or more radio-frequency components, the conductive paint layer including a plurality of overlapped metal flakes that define an electrically conductive layer.

A method for fabricating a radio-frequency module, the method comprising:

• providing a packaging substrate configured to receive a plurality of components, the packaging substrate including a ground plane disposed below a surface of the packaging substrate;
• mounting one or more radio-frequency components on the surface of the packaging substrate;
• forming a plurality of radio-frequency shielding wirebonds around the one or more radio-frequency components so that the radio-frequency shielding wirebonds are electrically connected to the ground plane;
• forming an overmold structure to substantially encapsulate the one or more radio-frequency components and the radio-frequency shielding wirebonds, and so that the overmold structure defines an upper surface that exposes upper portions of the radio-frequency shielding wirebonds;
• and
• forming a conductive paint layer on the upper surface of the overmold structure so that the conductive paint layer, the radio-frequency shielding wirebonds, and the ground plane form an radio-frequency shielded volume about the one or more radio-frequency components, the conductive paint layer including a plurality of overlapped metal flakes that define an electrically conductive layer.

A radio-frequency device comprising:

• a transceiver configured to process radio-frequency signals;
• an antenna in communication with the transceiver and configured to facilitate transmission of an amplified radio-frequency signal and reception of a received signal;
• and
• an radio-frequency module interconnected to the transceiver and the antenna to facilitate the transmission of the amplified radio-frequency signal or the reception of the received signal, the radio-frequency module including a shielded volume defined by a plurality of radio-frequency shielding wirebonds that electrically connect a conductive paint layer and a ground plane, the conductive paint layer including a plurality of overlapped metal flakes that define an electrically conductive layer.