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US 2019/0198450 A1Published application
Semiconductor package and semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsJoungphil LEE, YEONGSEOK KIM
Life of this patent
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Abstract
Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.
Claims20
A semiconductor package, comprising:
- a package substrate;
- a semiconductor chip disposed on the package substrate;
- a molding layer covering the semiconductor chip and a first region of the package substrate;
- and
- a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.
2 more elements
A semiconductor module, comprising:
- a module substrate;
- a first semiconductor chip disposed on the module substrate and having a first height;
- a second semiconductor chip disposed on the module substrate and having a second height different from the first height;
- and
- a functional layer covering the first semiconductor chip, the second semiconductor chip and extending onto a top surface of the module substrate between the first semiconductor chip and the second semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.