Hybrid Integrated Circuit Architecture

A method of manufacturing an electronic assembly, comprising:

• providing a first component chip having a first component chip top surface, a first component chip bottom surface and first component chip side surfaces;
• said first component chip comprising at least one first component contact pad on said first component chip top surface;
• providing a handle wafer having a first surface;
• attaching said first component chip top surface to said first surface of said handle wafer;
• providing a carrier wafer having a top wafer surface and a bottom wafer surface;
• forming in the carrier wafer an electronic integrated circuit having a first integrated circuit contact pad on the top wafer surface;
• forming in the carrier wafer a through-wafer cavity having walls that join said top wafer surface to said bottom wafer surface;
• attaching said top wafer surface to said first surface of said handle wafer such that said first component chip is arranged within said through-wafer cavity;
• filling at least a portion of said through wafer cavity with an attachment material attaching at least one wall of the through-wafer cavity to at least one of the first component chip bottom surface and one first component chip side surface;
• detaching the handle wafer from the first component chip top surface and the top wafer surface;
• and
• forming a first conductor between the first integrated circuit contact pad and said first component contact pad.